LASER MICROMACHINING LABORATORY

The increasing demand for miniaturisation of devices has established laser micromachining as the preferred fabrication method in many industrial applications. Indeed, do to their short wavelength (up to UV regime), short pulselength (nanosecond regime) and excellent beam quality (TEM00 mode), the innovative laser sources (DPSSL) have gained recognition by industry as competitive solution for material processing applications such as precision drilling, cutting and milling. Depending on the chosen wavelength and configuration, these laser sources are capable of directly machining a wide range of micron scale features in a large range of materials, including metals, semiconductors, ceramics, hard materials, polymers and glasses.


KIND OF WORKING
Laser Microcutting
Laser Microdrilling
Laser Microstructuring


FEATURES
High quality with low thermal damage
High reproducibility
High aspect ratio
Excellent taper angle control
High process speed
Complex shapes
High flexibility: micro-drilling, cutting and milling from a
single system


FIELDS OF APPLICATION
Automotive
Aerospace
Chemical
Textile
Medical and biomedical
Microfluidic
Micromechanics
Microelectronics


TECHNICAL SPECIFICATIONS
Thickness up to 2 mm
Hole diameter down 5 mm
Kerf width down 10 µm
Aspect ratio up to 50:1
Taper up to 0°
Accuracy up to 1 µm







RTM proposes the development and rationalization of new processes and new products (feasibility study and setting up of processes) and the activity of laser job-shop on prototypes, pre-series and lots of production. Moreover, RTM provides f ully specified industrial micromachining systems, which can be equipped in a modular architecture on the basis of customer requests. Depending on the applications and requirements of the users, the system can be customized with a choice of multi-axis motion control, scanners, vision system, software or full automation.